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The Evolution of Laptop CPU’s – Part 1

Posted on February 13th, 2010 | by admin

Ancient Mammoths

 

Back in the pioneering years, a computer would mean an a huge room of mechanical and electrical components.  These machines were custom designed to perform only a limited number of tasks.  They can only be operated by a dedicated team of specially trained technicians.  A single unit would cost an entire company department.  Back then, computers were not meant for individuals or home use.  Only large corporations need and own them.

 

Rise of the Machine: Desktop Computers

 

In November 1971, the world’s first commercial microprocessor, the Intel 4004, was released.  It’s general purpose architecture opened the possibilities for multiple applications from a single chip design.  Combined with Intel’s RAM chip, a new era of personal desktop computers was ushered.  Altair 8800, IMSAI 8080 and other models immediately made their way for personal use.  Microsoft and Apple Computers emerged from this revolution.  They made personal computers useful and available for the general public. 

 

Attack of the Clones: IBM PC Compatibles

 

The arrival of the IBM PC finally set the standard for general purpose, low cost and practical computing.  Small businesses, professionals and hobbyists can now afford desktop computer hardware and software.  The high availability of the IBM PC further encouraged the development of related technologies that eventually created its own industry – the PC.  Students, hobbyists and programmers can now create simple and robust games or applications which were easily distributed through floppy disks.  The industry flourished to the extent that IBM eventually lost control of the PC standard while it slowly took life from Microsoft and Intel.

 

Portable Heavyweights

 

The idea of having a portable computer is not a recent concept as you might think.  Even 4 decades ago, Xerox PARC already wanted to produce a self-contained personal computer.  This means a self-enclosed design where most components are attached for a quick pack-up and easy deployment.  These “luggable” personal computers typically weighed from 10-30 kilograms (22-66 pounds) and folded into a size of a portable sewing machine.  The monitors are about 6-9 inches is diameters while the keyboard are revealed when unfolded.  A mouse may be included.

 

NoteTaker: The First Portable Computer

 

The Xerox NoteTaker was developed in 1976.  It came with an 8-bit 1MHz CPU and 128KB of RAM which were advanced during its time.  The NoteTaker came with a monochrome display, a floppy disk drive, and a mouse.  It ran on SmartTalk a graphical operating system weighed 22kg (48lbs.).  While it was very promising, only 10 prototypes were made and it never entered production. 

 

The Osborne Effect – Revisited

 

The first commercially successful portable personal computer was the Osborne 1.  This portable computer was released in 1981.  It featured a 4MHz Z80 CPU, 64KB RAM, detachable keyboard, parallel/serial ports and ran on the CP/M operating system.  It was mainly based on the Xerox NoteTaker. 

 

Compaq vs. Hyperion

 

The Compaq Portable was released in January 1983 and came with a larger 9-inch green screen.  Hyperion rivaled Compaq because it was the first portable IBM PC compatible computer.  It was also shipped in January 1983 with 256KB RAM, 360KB 5.25” floppy drive, 7-inch CGA monitor and a 300bps modem.  Office software were bundled.  In February 1984, IBM finally released their first luggable machine, the Portable PC 5155 model 68. 

 

The Convertibles

 

The IBM PC Convertible model 5140 truly resembled a clam-shaped design of a modern laptop.  It was introduced in April 1986.  I was powered by an 4.77MHz Intel 80c88 CPU, 256+KB RAM, dual 720KB floppy drives and an monochrome CGA LCD screen.  It weighed 5.8kg (13 pounds) and includes a carrying handle.  The MinisPORT by Zenith Data Systems debuted in 1989.  This modern-looking laptop came with 640KB of RAM, 3.5” 1.44MB floppy drive, 20MB hard drive, 2.4K baud modem and a color LCD display. 

 

Toshiba vs. Mac

 

The Toshiba’s laptop series culminated with the T1200 in 1987.  It was ticking at 9.54MHz, 1MB RAM, a 720Kb 3.5” floppy drive and a 20MB hard drive.  Macintosh Portable arrived in 1989 with a 16MHz Motorola 68000 CPU at 16MHz bus, 1MB RAM that’s upgradeable to 5MB and a 3.5” 1.44MB floppy drive.  It weighed at 7.2kg (15.8lbs) because of its lead-acid batteries. 

 

The Laptop De Facto Standard

The Macintosh PowerBook series emerged in 1991 and eventually set the standards for the modern laptop form factor.  It introduced the first serious offering for the Laptop genre of personal computers.  Three versions were released to satisfy consumer budgets.  PowerBook 170 is the fastest of the Series.  It is driven by the 25MHz Motorola 68030 CPU, 4-8MB RAM, 40-80MB hard drive, 1.44MB floppy Superdrive, active matrix display, a trackball and Mac OS 7.6.

 

Mobile Intel

 

The laptop PCs in 1991 are limited to Intel 286 CPUs because 386 processors consume huge amounts of power. But the arrival of the power-optimized Intel 386SL processors included laptops in future CPU design considerations.  The 25MHz 386SL is a 386SX core integrated with a memory controller paired with an I/O chip to produce the SL chipset.  A System Management Mode (SMM) function is embedded.  It is packed with 855,000 transistors using 1 micrometer process.  This was widely implemented in the notebook market in its time.

 

486 Extinction

 

The Intel 486SL, a power saving and complete 486DX CPU, followed this path.  It was released on November 1992 and was clocked at 20, 25 and 33MHz.  This chip packed 1.4 million transistors, has SMM included and manufactured at 0.8 microns.  This model was later abandoned in favor for the arrival of the Pentium and mobile Pentium microprocessors.

 

Heated Confrontation: 030 vs. 486

 

The 32-bit Motorola 68030 CPU has an integrated Floating Point Unit and Memory Management Unit.  It has six stages of full-pipeline architecture.  The 030 is basically a shrunk 68020 core with added data cache.  This process allowed Motorola to pack more hardware on the CPU die.  However, the Intel 80486 used in 1994 laptops can be overclocked better without the overheating problems of the 030.  Because of this, Apple was unable to recover their lead in this period.  

 

The First Touchdown

 

The PowerBook 500 series is the first laptop to use a touchpad as pointing device.  The 500 series is powered by a 40MHz Motorola 5068LC040 CPU and can be upgraded to a 68040 that has an FPU.  It sports a 9.5-inch passive color display, 16-bit stereo sound and expansion options.

 

Multimedia Laptop 95

 

Microsoft Windows 95 implemented the Advanced Power Management specification.   This  simplified notebook power management in the OS.  Rebooting and entering the BIOS was no longer needed to set power management policies.  Windows 95’s multi-media features justified the need for CD-ROM drives and Intel Pentium CPUs for the laptop computers. 

 

Spinning Laptops

 

The Gateway Solo was the first 3-spindle (hard disk, optical & floppy) notebook computer.  At the same time, the IBM ThinkPad, Toshiba Satellite and the Dell Latitude were gaining reach  using Pentium-based 2-spindle (hard disk & floppy) systems in the corporate market.

 

Aim High PowerPC!

 

The PowerBook 5300 series was the first generation of PowerBook laptops to use the PowerPC processor in August 1995.  They are attributed as the first to feature hot-swappable expansion modules.  PowerPC is a RISC-based architecture (Reduced Instruction Set Computer) A CPU design strategy which uses simplified instructions.  It was designed by Apple, IBM and Motorola (AIM). 

 

Celeron’s Mission

 

During these periods, most Intel-base laptop computers are either using desktop processors or their scaled-down versions to prolong battery life.  The Pentium II CPU touched down on May 1997 running at 233-450MHz clock frequencies with 7.5 million transistors using 0.35 or 0.25 micron processes.  The first Intel Celeron microprocessor was based on the Pentium II chip.  It is similar in most ways including the clock speed and fabrication process.  The only difference are that they have little or no L2 caches, have slower bus speeds and have disabled multimedia features.   Mobile versions were developed for both PII and its Celeron counterpart.

 

PowerBook G3

 

The first PowerBook G3 shipped in 1997 with a 250MHz G3 processor and a 12.1″ TFT SVGA LCD.  The PowerPC G3 is not microprocessor, but in fact, a set of microprocessors from different vendors.  It is a 32-bit system designed and manufactured by IBM and Motorola.  The PowerPC 740 and 750 CPUs were introduced in late 1997 to power the PowerBook G3 laptop.  The CPU can reach speeds of up to 366MHz while only consuming 7.3W. 

 

K6 Redux

 

The AMD K6-2+ is an enhanced K6-2 with 570MHz core frequency and 128KB L2 cache using a 0.18 micron process.  It’s essentially a K6-III+ with only half the L2 cache. The K6-2+ was intended as a low-power mobile CPU.  It was released when mainstream desktop CPUs were quickly migrating on to newer platforms like the Athlon.  It sold in modest numbers to its target market.  The AMD K6-2+ chip were sometimes used on desktops.  

 

The PowerPC G3

 

The PowerPC G3 came with a 66MHz 60x system bus, 32KB instruction and 32KB data L1 caches, a second integer unit, an enhanced floating point unit, higher core frequency and on-die cache controller/tags. It supports the optional 256, 512 or 1,024KB external unified L2 cache.  Both caches are accessed by a dedicated 64-bit bus.  The 740/750 models contains 6.35 million transistors.  It was initially produced by IBM and Motorola using an aluminum-based 0.26 micron fabrication process.  

 

Pentium III: 3 Variants

 

The Pentium III was inaugurated on February 1999.  It housed 9.5 million transistors through a 0.25 micron process.  The Katmai version is clocked at 450-600MHz, 100-133MHz bus speed with Streaming SIMD Extensions (SSE) and  512KB off-die L2 cache.  The Coppermine CPUs ran from 500MHz–1.1GHz frequencies with 100-133MHz system bus and was made by a 0.18 micron process.  The Tualatin chip formalized the Gigahertz Era by starting at 1,133MHz and reaching 1.4GHz with a 133MHz bus.  The die has 32KB L1 cache and 256-512KB integrated L2 through a 0.13 micron process.  Mobile editions are available for Coppermine and Tualatin.

 

Mobile Celerons

 

The Coppermine (PIII) –based Celeron hit the market on March 2000 and featured 28.1 million transistors processed at 0.18 microns.  They operated from 533-850MHz with 66-100MHz system bus, 32KB L1 cache and 128KB L2.  The Tualatin (PIII) –based Celeron ran from 1-1.4GHz at 100-133MHz bus speed with 32KB L1 and 256KB L2 caches.  They were manufactured using the 0.13 micron technology process.  These 2 Celeron derivatives also have low-voltage versions specifically meant for the Mobile computing market. 

 

The Laptop Generation

 

The year 2000 is the time when the mobile computing market started to flourish because of the growing demands for multi-media notebooks and decreasing hardware costs.  A TFT LCD SVGA display became the minimum standard.  CD writers and floppy drives were included.  Multiple expansion ports are available around the laptop.  A Fax/Data modem and a 100-Base Ethernet adapter became the norm.  Hard drives were large enough and batteries gain longer hours.

 

The Mobile Athlon

 

The AMD Palomino Core was first released as a mobile version.  It was called the Mobile Athlon 4 or Corvette.  This stock has 64KB data & 64KB instruction L1 Cache and 256KB full-speed L2 Cache.  It ran with 133MHz FSB and has MMX, 3DNow! and SSE technologies. 

 

G4: The Last PowerBook

 

The PowerBook G4 laptop was announced at MacWorld Expo in January 2001.  On November 2002, the last version of PowerPC G4 featured a 867MHz or 1GHz clock speed with 256KB backside L2 cache and 1MB backside L3 cache. 

 

Pentium 4 Unleashed

 

The much awaited Pentium 4 desktop processor reached the public on November 2000.  It introduced the NetBurst Architecture which features very deep instruction pipelines that can reach frequencies up to 3.8GHz.  This rate is only limited by the Thermal Design Power that went as high as 115W.  The bus is only 100MHz but was Quad-Pumped to reach 400MHz.  It utilized SSE2 and later SSE3 instruction sets for better multi-media processing.  Newer Pentium 4 chips introduced the Hyper-threading (HT) Technology where a single physical CPU works as 2 virtual CPUs.

 

Mobile Mac for the People

 

The iBook, a line of Apple laptop computers between 1999 and 2005.  It initially ran on 500-900MHz PowerPC G3 CPUs with 32-576MB RAM.  The last editions used 800MHz-1.42GHz G4 processors with 256MB-1.5GB RAM.  It was targeted at the consumer and education markets with its lower specifications and prices. 

 

The Mobile Pentium

 

The Pentium 4-M processor entered the laptop market on April 2002.  It featured Intel’s SpeedStep and Deeper Sleep technologies for the laptop CPUs.  Other related laptop processors emerged like the Pentium III Mobile, Mobile Pentium 4 and Pentium M which is the fastest of the 4.  Unlike the desktop Pentium 4, Pentium 4-M has lower voltage, less heat and did not need an Integrated Heat Spreader (IHS). 

 

The Mobile Pentium 4 was developed to the address the self-defeating practice of using a full desktop Pentium 4 CPU in laptops.  The Mobile Pentium 4 ran on a Front-side Bus (FSB) of 533MHz and bridge the gap between Pentium 4 and Pentium 4-M. 

 

The Mobile Celeron

 

The Mobile Celeron was derived from the Mobile Pentium 4.  While the Celeron M processor is built from the Pentium M chip design and released on March 2003.  They are similarly clocked with their normal Pentium counterpart but performed better and drained more battery life.  These 2 Celerons differ from regular chips in terms of their lower FSB rating and reduced multi-media capacity. 

 

The Mobile Athlon XP

 

The mobile Athlon XP-M are identical Athlon XP.  It only worked at lower voltages, bus speeds and is not multiplier-locked. This enabled the chip to consume less power and generate less heat.  It was ideal for battery-powered laptops.  Athlon XP-M processors also have a higher heat tolerance making it suited to the tight conditions of a laptop.   Athlon XP-M is based on the newer Thoroughbred and Barton cores.  It replaced the older Mobile Athlon 4 that used the older Palomino core. 

 

The Intel Centrino Platform

 

In 2003, Intel launched the Centrino brand, a platform-marketing initiative.  A laptop with a Centrino sticker will have an Intel mobile chipset, a Pentium M CPU and a mobile Intel wireless adapter.  The Carmel platform is the first offering and included a Pentium M CPU, Intel 855 chipset and an 11MBps Wi-Fi adapter.  Sonoma platform followed on 2005 with a Pentium M CPU, Intel 915 chipset on 533MHz FSB and a 54MBps Wi-Fi adapter. 

Further reading: http://en.wikipedia.org/wiki/History_of_laptops and 

http://www.geekwithlaptop.com/laptop-revolution-where-size-does-mater-a-whole-lot

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Tags: CPU, games, History of Mobile CPU, History of Mobile Microprocessors, History of Mobile Processors, hp, laptop, Laptop CPU, mod, Ram

ATX 12V Power Supply DC Output Power Regulation

Posted on January 6th, 2010 | by admin

6TSGQJRH9JDV

DC Output Power Regulation

The DC output voltages shall remain within the regulation ranges shown in [Table 1] when

measured at the load end of the output connectors under all line, load, and environmental

conditions. The voltage regulation limits shall be maintained under continuous operation

for a period of time equal to or greater than the MTBF specified in Section 7.2 at any steady

state temperature and operating conditions specified in Section 5. [Src. Formfactors.org]

Output Range Min. Nom. Max. Unit
+12VDC * �5% +11.40 +12.00 +12.60 Volts
+5VDC �5% +4.75 +5.00 +5.25 Volts
+3.3VDC �5% +3.14 +3.30 +3.47 Volts
-5VDC �10% -4.50 -5.00 -5.50 Volts
-12VDC �10% -10.80 -12.00 -13.20 Volts
+5VSB �5% +4.75 +5.00 +5.25 Volts
* At +12 VDC peak loading, regulation at the +12 VDC output can go to � 10%.
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No tags for this poststyle="max-width:300px" />
class="heading">6TSGQJRH9JDV

DC Output Power Regulation

The DC output voltages shall remain within the regulation ranges shown in [Table 1] when

measured at the load end of the output connectors under all line, load, and environmental

conditions. The voltage regulation limits shall be maintained under continuous operation

for a period of time equal to or greater than the MTBF specified in Section 7.2 at any steady

state temperature and operating conditions specified in Section 5. [Src. Formfactors.org]

Output Range Min. Nom. Max. Unit
+12VDC * �5% +11.40 +12.00 +12.60 Volts
+5VDC �5% +4.75 +5.00 +5.25 Volts
+3.3VDC �5% +3.14 +3.30 +3.47 Volts
-5VDC �10% -4.50 -5.00 -5.50 Volts
-12VDC �10% -10.80 -12.00 -13.20 Volts
+5VSB �5% +4.75 +5.00 +5.25 Volts
* At +12 VDC peak loading, regulation at the +12 VDC output can go to � 10%.
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Computer Dictionary

Posted on January 6th, 2010 | by admin

Welcome to the Fury-Tech’s dictionary of computer related terms and definitions. Find a term in the Table of Contents to view a specific definition, or scroll down to view the entire list of terms.

Table of Contents

  1. AGP Aperture Size
  2. Active Cooling
  3. Auto Detect DIMM/PCI CLk
  4. Bank Interleave
  5. BIOS (Binary Input/Output System)
  6. Burst Mode
  7. Bus
  8. CAS (Column Access Strobe)
  9. CAS Latency
  10. CMOS (Complementary Metal-Oxide Semiconductor)
  11. DOS Flat Mode
  12. DRAM Command Rate
  13. DRAM Queue Depth
  14. FSB (Front Side Bus)
  15. Heatsink
  16. Jumper
  17. Lapping
  18. Molex connector
  19. Multiplier
  20. Passive Cooling
  21. Peltier
  22. RAS (Row Access Strobe)
  23. Spread Spectrum
  24. Stepping
  25. Thermal Compound
  26. Tcac (Column Access Time)
  27. Tras (Active to Precharge)
  28. Trcd (Active to CMD)
  29. Trp (Precharge to Active)
  30. Voltage

AGP Aperture Size:

^

The AGP Aperture Size is the amount of system ram to be shared with the AGP interface. Setting this value too high can steal too much system memory from applications, which can easily offset the benefit of more video RAM. The default setting of 64MB is usually fine, although you can experiment with higher and lower values yourself.

Active Cooling:

^

Active cooling refers to the use of an active system such as a fan, heatsink/fan combo or watercooling to cool computer components. (See also passive cooling).

Auto Detect DIMM/PCI CLk:

^

This is another method that can be used to reduce EMI (Electromagnetic Interference). When enabled, it will automatically turn off the clock cycles on unpopulated AGP, PCI or SDRAM slots. Clock cycles on populated slots will also be turned off when not in use if this option is enabled. Since there is no performance hit associated with this option, you can usually leave it on.

Bank Interleave:

^

Bank interleave allows consecutive data requests to RAM, cycling through each bank of memory. This can give a good performance boost with large RAM modules, since each bank of the module can be accessed consecutively. DRAM chips of 64Mbit or higher have 4 separate internal banks which can be active at the same time. You can set bank interleave to Disable, 2-bank or 4-bank. It is generally recommended that you use the highest setting (4-bank) whenever possible. Bank interleave doesn’t usually affect stability as long as the RAM module can support it.

BIOS (Binary Input/Output System):

^

The BIOS is software built-in to the motherboard. It is responsible for detecting and starting up basic device services in a computer at boot time. The BIOS can also contain a number of user-configurable settings, allowing you to control such things as RAM timings, CPU multiplier, AGP settings, and much more. If you plan on overclocking your computer, you will most likely spend a lot of time changing settings around in your BIOS.

Burst Mode:

^

This is a generic term, meaning that data is sent faster than normal across a communication line. Burst mode is implemented in many ways across the system bus, PCI bus, and caching methods for the IDE bus.

Bus:

^

When referring to personal computers, a bus is a collection of wires which are used to transfer data inside a computer system. A bus is made up of two separate buses: the data bus and the address bus. The data bus is used to transfer data from one device to another, and the address bus contains information about where that data should go.

CAS (Column Access Strobe):

^

A signal which tells the DRAM to accept an address as the column address. Used in conjunction with Row Access Strobe (see RAS) to select a bit of DRAM.

CAS Latency:

^

CAS latency refers to the ratio between column access time (see Tcac) and clock cycle time. Since column access time refers to the period after the CPU requests a column, to when the data is moved to the output line, a lower CAS latency means less clock cycles to move the data to the output line. It is usually recommended you use the lowest CAS latency which your RAM and motherboard can run stable with.

CMOS (Complementary Metal-Oxide Semiconductor):

^

The CMOS is a small amount of battery powered memory attached to your motherboard which allows your computer to store things like date and time, so they are not reset every time you turn your computer off. BIOS settings are also stored in the CMOS, and if there is ever a time when your BIOS modifications prevent your computer from booting up, there is usually a clear-CMOS jumper (see jumper) on your motherboard, which will clear the CMOS memory when removed for ~5 seconds.

DOS Flat Mode:

^

This setting enables DOS mode memory addressing. Windows already uses this method so only enable it if you are using an application that needs it. All memory will be seen as real, instead of as a segment and offset; this can result in better stability where it is needed.

DRAM Command Rate:

^

DRAM command rate specifies the time to wait after a chip select before activate and read can be started. It is usually recommended you use the lowest command rate that your RAM and motherboard can run stable with. However, at higher frequencies it may be necessary to increase the command rate latency.

DRAM Queue Depth:

^

DRAM queue depth specifies how deep row refresh requests can be queued. By queueing these requests, they can be issued in burst mode (see burst mode). This way multiple rows can be refreshed consecutively. It is usually recommended you use the highest queue depth which your RAM and motherboard can run stable with.

FSB (Front Side Bus):

^

Also known as the system bus, and sometimes the memory bus, the front side bus is the primary connection between the CPU and system memory. Other devices in the computer also derive their speeds from the FSB, such as the AGP bus and PCI bus. The AGP and PCI bus generally run at a slower speed than the FSB, and use a divider (see divider) to obtain the correct speed. The CPU also derives its clock speed from the FSB by applying a multiplier (see multiplier). Changing the frequency of the FSB can give you huge overclocks, but since so many components in your computer obtain their speeds from the FSB, it can cause a lot of stress on other components. It’s always best to take it one step at a time, so if you are overclocking your FSB then start in small increments. For example, if you normally run at 133MHz FSB, try 134 then test it, 135 then test, 136 then test, and so on.

Heatsink:

^

A heatsink is a block of metal that is used to help disperse heat from hot running components in your computer. The largest, and generally most important HS in your computer is the CPU heatsink. The CPU is the hottest running part of your computer, and it is important to help transfer heat away from the CPU as quickly as possible. You will also hear the term HSF, which is simply an acronym for HeatSink/Fan – usually referring to the combination of a heatsink and a cooling fan.

Jumper:

^

A jumper is basically a user controllable circuit. It generally consists of pins which are connected or disconnected using ’shunt’, a small plastic coated metal sheath. When closed (shunt is on), the circuit allows electricity to flow through. Jumpers are used for a number of things, and if you look closely at your motherboard you will probably see a few yourself – basically they look like small black plastic rectangles stuck on to two pins. In some cases jumpers are used to change FSB and multiplier settings, or clear the CMOS, or more.

Lapping:

^

Lapping is the term used to describe the process of smoothing the contact area of a heatsink. Generally this is done by using progressively finer grains of sandpaper to get the smoothest possible surface. This reduces the amount of air in the contact area and increases heat transfer.

Molex connector:

^

Molex is actually an electronics manufacturer that created many different cable adapters. However, the one molex adapter commonly found in PCs is commonly referred to as just “the molex plug” or the “the molex connector”. So when it comes to PC hardware, a Molex connector is the most common power connector found in a case – a 4 pin power connector with yellow/red wires providing +12V and +5V respectively, and two black wires for grounding.

Multiplier:

^

A multiplier is used by the CPU to obtain its clock speed. Since the CPU uses the clock of the FSB, it needs to multiply that clock speed by a number to achieve higher clock speeds itself. The basic formula is FSB x Multi = Clock Speed. For example, a FSB running at 133MHz, coupled with a CPU using a 10.5 multiplier, will result in a CPU running at 1.4GHz (133 x 10.5 = 1,396.5MHz). As you can see, changing either of these variables will result in a higher clock speed, and these are the two major numbers you will be changing if you want to overclock.

Passive Cooling:

^

Passive cooling refers to the use of a non-mechanical cooling method, such as a heatsink with no fan. Passive refers to the inactive method of cooling, since the cooling method relies on natural heat dissapation through a heatsink. (See also active cooling).

Peltier:

^

A peltier, or thermoelectric module, is generally a small plate which is mounted between the CPU and HSF. When an electrical current is applied to the peltier, all of the heat in the module is forced to the top, making the bottom very cold. This can be a useful component in moving heat off the CPU. In general terms, a peltier is an array of semiconductor pellets which have been doped so that either negative or positive charge carrier carries most of the current.

RAS (Row Access Strobe):

^

A signal which tells the DRAM to accept an address as the row address. Used in conjunction with Column Access Strobe (see CAS) to select a bit of DRAM.

Spread Spectrum:

^

This setting should almost always be disabled. To be CE listed in acceptance with the European market, this setting is included to help reduce EMI (Electromagnetic Interference). It can reduce system performance, so unless you are experiencing serious difficulty with EMI leave this setting off.

Stepping:

^

Stepping refers to the version of a CPU. Like a software application, version numbers change when bugs are fixed, and updates are made. Unlike software, the stepping of a CPU uses a different format for versioning, usually a proprietary code developed by the manufacturer. Usually the most recent stepping of a processor is the most stable and overclockable, but this isn’t always the case. Steppings are helpful when purchasing a CPU you intend to overclock, since doing a little research on the good steppings can help you find the most overclockable chip.

Thermal Compound:

^

Thermal compound is generally a paste or silver based compound which is applied between a heatsink and the chip being cooled. Thermal compound is important in transferring heat off a chip. Normally the surfaces of the heatsink and chip are imperfect, meaning there are microscopic ridges and bumps on the surface; thermal compound helps to fill these trenches and increase heat transfer into the heatsink.

Tcac (Column Access Time):

^

Column access time is the time it takes for data to be moved to the ouput line after the CPU makes a column request on the CAS line.

Tras (Active to Precharge):

^

Tras specifies the amount of time required between an active command to a precharge command. Basically this means the number of cycles that must pass after a bank is opened to when it can be closed. It is usually recommended you use the lowest Tras which your RAM and motherboard can run stable with.

Trcd (Active to CMD):

^

Trcd, also known as Active to CMD or RAS-to-CAS, is the time we have to wait between a row access request and a column access request. It is usually recommended you use the lowest Trcd which your RAM and motherboard can run stable with.

Trp (Precharge to Active):

^

The amount of time from a bank precharge request to when it can be activated. It is usually recommended you use the lowest Trp which your RAM and motherboard can run stable with.

Voltage:

^

The rate at which energy is drawn from an electrical source. This is an important term to be familiar with when overclocking, since an overclocked device will usually require a higher voltage to remain stable. Generally speaking, as the frequency of a chip increases, it requires more voltage to bridge a gap in the unit. Since all silicon has impurities, there will always be gaps. At low clock speeds the current has a chance to go around the gap, but as the clock speed increases the chances of a current not making the jump in time, or at all, increase. Higher voltage will help to sustain a higher clock, but it also increases the heat emitted, and the potential to damage the chip.

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Benchmarking Tools and Utilities

Posted on January 6th, 2010 | by admin

Below you will find a collection of benchmarking utilities you can use to test your system, speed, and stability.

DSP & FPGA

Best Places to Buy Benchmarking Tools and Utilities
Store Rating Store Name Price Visit Store

683 Store Reviews

zZounds.com
$ 1299.00 Go!

134 Store Reviews

American Musical Supply
$ 1299.00 Go!

683 Store Reviews

zZounds.com
$ 1799.00 Go!

226 Store Reviews

Amazon Marketplace
$ 1499.00 Go!

134 Store Reviews

American Musical Supply
$ 1799.00 Go!
Tags: CPU